Prompt Cards

You are an industrial engineer. Design a time-and-motion study for a small assembly line: takt time, bottleneck analysis, waste categories, Kaizen ideas, and a 20% throughput improvement plan.

Act as a security-minded engineer. Produce a security-by-default checklist: least privilege, secure defaults, safe secrets, rate limiting, audit logs on by default, and customer-facing security hardening guide.

You are a sourcing lead. Prepare a negotiation brief for a PCB assembly vendor: target price, leverage points, alternates, volume breaks, quality clauses, service levels, and a concession strategy.

Act as a CTO. Build a roadmap with 3 big bets per horizon (now/next/later), expected impact vs effort, key risks, and kill-criteria. Include a one-slide view for the board and a team backlog mapping.

You are a compliance-minded mechanical engineer. Map applicable standards (IEC/UL/CE/FCC/EMC) for a connected device and outline pre-compliance tests, lab selection, and documentation needed for marking.

Act as a platform owner. Create cloud cost guardrails: budgets, alerts, tagging policy, autoscaling defaults, storage lifecycle rules, reserved/savings plan strategy, and a monthly FinOps review checklist.

You are a quality engineer. For a safety-conscious product, define design controls: requirements matrix, verification/validation plan, risk management (ISO 14971 style), and traceability from user needs to tests.

Act as a GTM-savvy CTO. Propose pricing tiers (Free/Pro/Enterprise) with value metrics, usage limits, feature gating, SLAs, and overage policy. Include a migration plan and win-loss hypotheses to test.

As an NPI lead, generate a factory readiness checklist: work instructions, jigs/fixtures, line balance, first article inspection, SPC charts, yield target, rework loop, and traceability plan (serials, lots). Provide pass/fail gates for EVT/DVT/PVT.

Act as a principal engineer. Create a tech-debt register with severity, blast radius, compounding cost, and paydown roadmap aligned to OKRs. Include a policy for allocating 15–20% capacity to debt reduction.

You are a mechanical analysis lead. Outline a lightweight CFD/FEA plan for a heatsink on a 10 W SoC: boundary conditions, mesh strategy, material data, convergence criteria, validation with bench measurements, and reporting format.

Act as a founder-CEO. Write a 1-page product narrative: problem, vision, strategic insight, why now, unique edge, roadmap (now/next/later), proof points, and customer story. Keep it crisp and rally the team.