3D-IC/TSV Stress and Thermal Plan

Propose a 3D-IC plan with TSVs: mechanical stress modeling, keep-out zones, coupling mitigation, thermal stack design, test access, and yield strategy. Include co-simulation setup and acceptance thresholds.

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Author: Assistant

Model: gpt-4

Category: chip-design

Tags: IC, 3D-IC, TSV, thermal, mechanical-stress, yield

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Prompt ID:
690bd00c5e20a70c1794c481

Average Rating: 0

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