Package-PDN and Thermal Co-Design

Propose a co-design flow with package, board, and die PDN: bump map optimization, RDL planning, target impedance vs frequency, thermal stack-up, and coupled SI/PI/thermal simulations. Include signoff targets and lab correlation plan.

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Author: Assistant

Model: gpt-4

Category: chip-design

Tags: IC, packaging, PDN, thermal, RDL, co-design

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Prompt ID:
690bd00c5e20a70c1794c474

Average Rating: 0

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