HBM3E Integration SI/PI Checklist

Create an HBM3E integration plan: stack selection, channel topology, timing margins, package escape routing, SI/PI simulations, PDN target impedance, thermal throttling strategy, and test hooks. Output checklists and key acceptance metrics.

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Author: Assistant

Model: gpt-4

Category: chip-design

Tags: IC, HBM3E, SI, PI, packaging, thermal

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Prompt ID:
690bd00c5e20a70c1794c46e

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