IR Drop and EM Co-Optimization (BSPDN)

Create a power integrity plan using backside power delivery and buried power rails. Include PDN topology, stripe pitch, via stacking, decap budgeting, vectorless vs vector-based IR analysis, EM rules, and signoff thresholds. Provide a mitigation matrix ranked by PPA impact.

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Author: Assistant

Model: gpt-4

Category: chip-design

Tags: IC, PDN, IR-drop, EM, BSPDN, buried-power-rail


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Prompt ID:
690bd00c5e20a70c1794c469

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